The ProtoLaser U3 shows how quickly applications can be processed. A UV laser beam can depanel individual PCBs from large circuit boards stress-free, cut LTCC and prepregs, drill holes and microvias, and structure FR4 substrates. The high pulse energy of the UV laser eliminates residue from the ablation process, resulting in geometrically precise contours. Switching between products is hassle free; the system simply requires a new project file to be loaded, offering maximum flexibility. Please check our website to see the latest advances on the ProtoLaser models.